Fracture Putty

DARPA seeks to develop a dynamic putty which, when packed in/around a compound bone fracture, provides full load-bearing capabilities within hours, creates an osteoconductive bone-like internal structure, and degrades over time to harmless resorbable by-products as normal bone regenerates.

"See


Attached Broad Agency Announcement (BAA)"
Related Programs

Research and Technology Development

Department Of Defense


Agency: Department of Defense

Office: Defense Advanced Research Projects Agency

Estimated Funding: Not Available


Who's Eligible


Relevant Nonprofit Program Categories





Obtain Full Opportunity Text:
Not Available

Additional Information of Eligibility:
Not Available

Full Opportunity Web Address:
DARPA-BAA-08-50

Contact:
Mitchell Zakin

Agency Email Description:
BAA COORDINATOR

Agency Email:
BAA08-50@DARPA.MIL

Date Posted:
2008-08-13

Application Due Date:
2009-06-04

Archive Date:
2009-07-04



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