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FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U. S. semiconductor industry.
This is the first Notice of Funding Opportunity under this program.
It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.
This is the first Notice of Funding Opportunity under this program.
It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.
Agency: Department of Commerce
Office: National Institute of Standards and Technology
Estimated Funding: $0
Office: National Institute of Standards and Technology
Estimated Funding: $0
Obtain Full Opportunity Text:
Infrastructure eXCHANGE website
Additional Information of Eligibility:
Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments.
Eligible applicants may only submit one full application under this NOFO.
Entities may not be included as subrecipients on more than two applications.
Full Opportunity Web Address:
https://infrastructure-exchange.energy.gov/
Contact:
Agency Email Description:
Agency Contact
Agency Email:
Date Posted:
2024-02-28
Application Due Date:
Archive Date:
2024-08-02
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