FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U. S. semiconductor industry.

This is the first Notice of Funding Opportunity under this program.

It seeks applications for

credit:


new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.




Obtain Full Opportunity Text:
Infrastructure eXCHANGE website

Additional Information of Eligibility:
Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments.

Eligible applicants may only submit one full application under this NOFO.

Entities may not be included as subrecipients on more than two applications.

Full Opportunity Web Address:
https://infrastructure-exchange.energy.gov/

Contact:


Agency Email Description:
Agency Contact

Agency Email:


Date Posted:
2024-02-28

Application Due Date:


Archive Date:
2024-08-02



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