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National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging.
This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas:
(1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas:
(1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
Agency: Department of Commerce
Office: National Institute of Standards and Technology
Estimated Funding: $12,000,000
Office: National Institute of Standards and Technology
Estimated Funding: $12,000,000
Obtain Full Opportunity Text:
https://eere-exchange.energy.gov/Default.aspx#FoaId25b8136c-aa7b-4ed2-b7af-89c1a6d6e953
Additional Information of Eligibility:
Eligible applicants are domestic non-profit organizations; domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations.
A domestic entity is one that is incorporated within the United States (including a U. S. territory) with its principal place of business in the United States (including a U. S. territory).
Full Opportunity Web Address:
https://eere-exchange.energy.gov/Default.aspx#FoaId25b8136c-aa7b-4ed2-b7af-89c1a6d6e953
Contact:
Agency Email Description:
Agency Contact
Agency Email:
Date Posted:
2024-10-18
Application Due Date:
Archive Date:
2025-01-19
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