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Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)
The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U. S. Department of Defense (DoD) electromagnetic (EM) systems.
Proposals will focus on one or more of the following technical areas:
1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components.
Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Proposals will focus on one or more of the following technical areas:
1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components.
Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Agency: Department of Defense
Office: Defense Advanced Research Projects Agency
Estimated Funding: $26,000,000
Office: Defense Advanced Research Projects Agency
Estimated Funding: $26,000,000
Obtain Full Opportunity Text:
DARPA Solicitations Page
Additional Information of Eligibility:
Not Available
Full Opportunity Web Address:
http://www.darpa.mil/work-with-us/opportunities
Contact:
Dr. William D. PalmerDARPA Program Manager
Agency Email Description:
BAA Coordinator
Agency Email:
DARPA-BAA-16-36@darpa.mil
Date Posted:
2016-06-16
Application Due Date:
2016-08-01
Archive Date:
2016-08-31
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