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Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)
Amendment 01:
The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline.
See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.
Original Synopsis Below.
The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document.
The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline.
See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.
Original Synopsis Below.
The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document.
Agency: Department of Defense
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Obtain Full Opportunity Text:
DARPA Solicitations Page
Additional Information of Eligibility:
Not Available
Full Opportunity Web Address:
http://www.darpa.mil/work-with-us/opportunities
Contact:
Dr. Daniel GreenMTO Program Manager
Agency Email Description:
BAA Coordinator
Agency Email:
DARPA-BAA-16-62@darpa.mil
Date Posted:
2016-09-29
Application Due Date:
2017-01-13
Archive Date:
2017-07-13
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